De Paola, Francesco Maria (2003) Silicon as Smart Package for Photonic ICs. [Tesi di dottorato] (Unpublished)

[img]
Preview
PDF
De_Paola.pdf

Download (4MB) | Preview

Abstract

In this thesis, the research is described for realizing hybrid modules where silicon can be used to effectively improve different functionalities of the photonic device. Several aspect are detailed, spanning from the techology to implement the hybrid modules to the description of some particular photonic devices that might improve their performance when mounted onto a silicon carrier. Also, some considerations about different amplifier architectures for optical communications are presented and completed with practical implementations in an advanced university bipolar process.

Item Type: Tesi di dottorato
Uncontrolled Keywords: optical communications, flip-chip, silicon devices, InP, hybrid modules, SOC
Depositing User: Anna Tafuto
Date Deposited: 11 Oct 2005
Last Modified: 30 Apr 2014 19:22
URI: http://www.fedoa.unina.it/id/eprint/123

Actions (login required)

View Item View Item