De Paola, Francesco Maria (2003) Silicon as Smart Package for Photonic ICs. [Tesi di dottorato] (Unpublished)

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Item Type: Tesi di dottorato
Language: English
Title: Silicon as Smart Package for Photonic ICs
Creators:
CreatorsEmail
De Paola, Francesco MariaUNSPECIFIED
Date: 2003
Date Type: Publication
Number of Pages: 128
Institution: Università degli Studi di Napoli Federico II
Department: Ingegneria elettronica e delle telecomunicazioni
PHD cycle: 16
PHD Coordinator:
nameemail
Paura, LuigiUNSPECIFIED
Tutor:
nameemail
Rinaldi, NiccolòUNSPECIFIED
Date: 2003
Number of Pages: 128
Uncontrolled Keywords: optical communications, flip-chip, silicon devices, InP, hybrid modules, SOC
MIUR S.S.D.: Area 09 - Ingegneria industriale e dell'informazione > ING-INF/01 - Elettronica
Area 09 - Ingegneria industriale e dell'informazione > ING-INF/03 - Telecomunicazioni
Date Deposited: 11 Oct 2005
Last Modified: 30 Apr 2014 19:22
URI: http://www.fedoa.unina.it/id/eprint/123

Abstract

In this thesis, the research is described for realizing hybrid modules where silicon can be used to effectively improve different functionalities of the photonic device. Several aspect are detailed, spanning from the techology to implement the hybrid modules to the description of some particular photonic devices that might improve their performance when mounted onto a silicon carrier. Also, some considerations about different amplifier architectures for optical communications are presented and completed with practical implementations in an advanced university bipolar process.

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