De Paola, Francesco Maria (2003) Silicon as Smart Package for Photonic ICs. [Tesi di dottorato] (Unpublished)
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|Item Type:||Tesi di dottorato|
|Uncontrolled Keywords:||optical communications, flip-chip, silicon devices, InP, hybrid modules, SOC|
|Date Deposited:||11 Oct 2005|
|Last Modified:||30 Apr 2014 19:22|
In this thesis, the research is described for realizing hybrid modules where silicon can be used to effectively improve different functionalities of the photonic device. Several aspect are detailed, spanning from the techology to implement the hybrid modules to the description of some particular photonic devices that might improve their performance when mounted onto a silicon carrier. Also, some considerations about different amplifier architectures for optical communications are presented and completed with practical implementations in an advanced university bipolar process.
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