De Paola, Francesco Maria (2003) Silicon as Smart Package for Photonic ICs. [Tesi di dottorato] (Unpublished)
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| Item Type: | Tesi di dottorato |
|---|---|
| Resource language: | English |
| Title: | Silicon as Smart Package for Photonic ICs |
| Creators: | Creators Email De Paola, Francesco Maria UNSPECIFIED |
| Date: | 2003 |
| Date type: | Publication |
| Number of Pages: | 128 |
| Institution: | Università degli Studi di Napoli Federico II |
| Department: | Ingegneria elettronica e delle telecomunicazioni |
| Ciclo di dottorato: | 16 |
| Coordinatore del Corso di dottorato: | nome email Paura, Luigi UNSPECIFIED |
| Tutor: | nome email Rinaldi, Niccolò UNSPECIFIED |
| Date: | 2003 |
| Number of Pages: | 128 |
| Keywords: | optical communications, flip-chip, silicon devices, InP, hybrid modules, SOC |
| Settori scientifico-disciplinari del MIUR: | Area 09 - Ingegneria industriale e dell'informazione > ING-INF/01 - Elettronica Area 09 - Ingegneria industriale e dell'informazione > ING-INF/03 - Telecomunicazioni |
| Date Deposited: | 11 Oct 2005 |
| Last Modified: | 30 Apr 2014 19:22 |
| URI: | http://www.fedoa.unina.it/id/eprint/123 |
| DOI: | 10.6092/UNINA/FEDOA/123 |
Collection description
In this thesis, the research is described for realizing hybrid modules where silicon can be used to effectively improve different functionalities of the photonic device. Several aspect are detailed, spanning from the techology to implement the hybrid modules to the description of some particular photonic devices that might improve their performance when mounted onto a silicon carrier. Also, some considerations about different amplifier architectures for optical communications are presented and completed with practical implementations in an advanced university bipolar process.
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