Scognamillo, Ciro (2023) Analysis of heat propagation and electrothermal effects in electronic devices and circuits. [Tesi di dottorato]
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| Tipologia del documento: | Tesi di dottorato |
|---|---|
| Lingua: | English |
| Titolo: | Analysis of heat propagation and electrothermal effects in electronic devices and circuits |
| Autori: | Autore Email Scognamillo, Ciro ciro.scognamillo@unina.it |
| Data: | 9 Marzo 2023 |
| Numero di pagine: | 140 |
| Istituzione: | Università degli Studi di Napoli Federico II |
| Dipartimento: | Ingegneria Elettrica e delle Tecnologie dell'Informazione |
| Dottorato: | Information technology and electrical engineering |
| Ciclo di dottorato: | 35 |
| Coordinatore del Corso di dottorato: | nome email Russo, Stefano stefano.russo@unina.it |
| Tutor: | nome email d'Alessandro, Vincenzo [non definito] |
| Data: | 9 Marzo 2023 |
| Numero di pagine: | 140 |
| Parole chiave: | electrothermal effects, electrothermal simulation, heat propagation, power electronics, thermal modeling |
| Settori scientifico-disciplinari del MIUR: | Area 09 - Ingegneria industriale e dell'informazione > ING-INF/01 - Elettronica |
| Depositato il: | 15 Mar 2023 08:54 |
| Ultima modifica: | 10 Apr 2025 14:05 |
| URI: | http://www.fedoa.unina.it/id/eprint/15161 |
Abstract
Over the last 50 years, efforts of the academic research and industry in the field of electronics engineering have contributed to the development of devices and circuits based on semiconductors with unrivaled electrical features. However, the use of such technologies is still limited and hindered by thermally-induced issues. Self-heating phenomena - inevitably occurring even under standard working conditions - (i) negatively affect the electrical performance of devices, (ii) reduce their long-term reliability, and (iii) may lead to irreversible failures. My research activity falls within this domain and addresses the study of heat propagation and electrothermal effects (i.e., the impact of power-temperature feedback on electrical characteristics). More specifically, I have been focusing on thermal/electrothermal modeling and simulation of devices and circuits; both tasks are of crucial importance in the design and testing stages, even more in the light of technological improvements that, paradoxically, may exacerbate the negative consequences of self-heating phenomena. Among the topics I contributed to, it is worth mentioning how, through thermal analyses based on methodologies developed and updated during these three years, detailed studies were carried out on the behavior of single- and double-sided cooled power modules, SiC- and GaN-based devices, and power circuits included in printed circuit boards. The compact thermal networks extracted from such analyses were coupled with electrical models of transistors, thus generating highly-efficient electrothermal simulation tools. In addition, an in-situ thermal impedance measurement technique is presented in this dissertation. The technique is unique in the field of power electronics, as it allows the identification of the dynamic thermal behavior of devices within the application environment in which they are deployed, without any need for laboratory measurements.
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